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| XY Grid Scan | BF & DF Optical Detection |
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| Automatical loading from cassetee to stage | Automatical clamping |
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| Scratch | Chipping | TGV Holes | Pinholes |

| FE-AOI-M | FE-AOI-A | Customize | |
| Spatial resolution | ~ 3 μm | ~ 3 μm | ~ 1 μm |
| Light source | LED high-intensity light source | LED high-intensity light source | LED high-intensity light source, Raman Spectroscopy, Fluorescence Spectrum, SHG Imaing |
| Stage displacement accuracy | 2 μm | ||
| Scan time | <3 min / piece (diameter 6-inch) | ||
| Applicable wafer size | maximum diameter 8-inch | maximum diameter 8-inch | maximum diameter 8-inch |
| Camera parameters | DF: 16-bit; 2992 × 3000 BF: 8-bit; 3008 × 3000 |
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| Stage |
Sample hangs on the stage. |
Sample hangs on the stage. Touch points are at the edge of the sample. Replaceable stage. ± 125 mm (XY); ± 10 mm (Z) Automatically clamping |
Customizable |
| Scratch detection | Detection limit: 20 nm (depth) Positive rate: equivalent to imported SiC defect detection equipment |
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| Chipping detection | Detection limit: 50 μm x 50 μm Positive rate: >95% (100 μm x 50 μm) |
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| Robot arm | NA | Single arm / Vac-sorb Mapping, Flipping supported |
Customizable |
| Position alignment | NA | Vac-sorb | Customizable |
| Cassette quantity supported | NA | 2 ~ 4 | Customizable |
| Safety interlock door | NA | Proximity sensor on the door. Power would be cut off when door opens. |
Customizable |
| Working voltage | 220 V | ||
| Working temperature / relative humidity | 5 ~ 40 ℃ / < 80 % | ||
| Warranty period | 1 Year | ||